JCET's Mid-term Report for 2025 Unearths: Boosts Funding in Sophisticated Packaging, Records ReMARKable Q2 and H1 Sales Figures

JCET Group Reports Strong H1 2025 Financial Results

In a recent announcement, JCET Group, a global leader in integrated circuit back-end manufacturing and technology services, reported robust financial results for the first half of 2025. The company recorded a revenue of RMB 18.61 billion, marking a 20.1% year-on-year increase.

The growth was driven by strong performances in various sectors. JCET achieved year-on-year revenue increases in computing electronics, industrial and medical electronics, and automotive electronics of 72.1%, 38.6%, and 34.2% respectively.

JCET Group's success can be attributed to its close technology collaboration and efficient supply chain manufacturing for its global customers. The company optimized its global manufacturing footprint and supply chain systems during the reporting period, enabling it to meet the growing demand in the electronics industry.

JCET Group operates eight manufacturing sites across China, Korea, and Singapore, and has sales centers around the world. The company offers a full range of turnkey solutions, including semiconductor package integration design and characterization, R&D, wafer probing, bumping, package assembly, final testing, and drop shipment.

In H1 2025, JCET significantly increased its investment in advanced packaging technologies and production capacity. This investment has resulted in a significant increase in overall capacity utilization compared to the same period last year. The company's portfolio spans a broad range of semiconductor applications, including mobile, communications, computing, consumer, automotive, and industrial.

Net profit attributable to owners of the parent for H1 2025 was RMB 470 million, with Q2 contributing RMB 270 million. Total R&D expenditure reached RMB 990 million, marking a 20.5% increase year-on-year.

Notably, JCET Group established a wholly-owned subsidiary, JCET (Jiangyin) Co., Ltd., to focus on System-in-Package (SiP) technologies and intelligent manufacturing. The automotive back-end manufacturing base of JCET Shanghai Automotive Co., Ltd. is scheduled to begin operations in the second half of 2025.

However, the new CEO of JCET Shanghai Automotive Co., Ltd., which will commission a new production site in the second half of this year, is not publicly disclosed in available sources.

For more detailed information, readers are encouraged to refer to the JCET Q2 2025 Report. The company's continued growth and investment in advanced technologies position it well for future success in the dynamic electronics industry.