National Science Foundation dispenses $42.4 million in fresh grants, financing the forthcoming semiconductor sector
The U.S. National Science Foundation (NSF) has announced a significant investment of $42.4 million in grants for its Future of Semiconductors (NSF FuSe2) competition. These grants aim to revolutionize computing by developing cutting-edge technologies such as ultra-thin oxide semiconductors, novel chip designs, and advanced algorithms.
The research projects, spanning across 20 institutions and 15 different states, will advance energy efficiency within computing systems. Some of the key focus areas include hardware for deep neural networks, vertical power delivery systems, and high-density 3D-integrated circuits.
Texas A&M University is researching edge reinforcement learning with algorithm, architecture, and circuit co-design. Their work aims to improve the efficiency and performance of computing systems at the edge of a network, such as in mobile devices and IoT devices.
Purdue University is working on Strain and Temperature Ex-Situ Processing of Ferroelectric Oxides (STEP FOx) for BEOL performance. This project focuses on a versatile neural computing platform using Indium-Oxide.
The University of Michigan is focusing on heterogeneous in-package photonics with reconfigurable optical switching for AI clusters. This research could lead to more efficient and powerful AI systems by integrating photonics, the study of light, with electronics.
The University of Arizona is developing ultrafast energy-efficient antiferromagnetic tunnel junctions. These junctions could potentially store and process information faster and more efficiently than current technologies.
The University of Maryland, College Park is focusing on high-performance & energy-efficient in-memory computing devices with co-designed 2D ferroelectric materials and stacks. In-memory computing could significantly reduce the time it takes to process data, making computers faster and more efficient.
The University of Minnesota, Twin Cities project aims to develop 3D vertical back-end-of-line ferroelectric memcapacitors and in-memory computing circuits. This research could lead to more dense and energy-efficient memory systems.
The University of Kansas is co-designing sub-2nm wide-bandgap semiconductor memristors for neuromorphic computing. Neuromorphic computing mimics the structure and function of the human brain, potentially leading to more intelligent and adaptive computing systems.
The University of California, Santa Barbara is AI-enhancing material-device codesign of Boron Arsenide as the next-generation semiconductor. Boron Arsenide could potentially offer improved performance and efficiency compared to current semiconductor materials.
Louisiana State University is working on Louisiana Synchrotron-Sourced UV for advanced resist materials and mechanisms. This research could lead to the development of new materials for use in semiconductor manufacturing.
The University of California, Riverside is developing magnonic combinatorial memory and logic devices on a silicon platform. These devices could potentially offer faster and more energy-efficient data storage and processing.
The University at Buffalo is developing energy-efficient nanoelectronics based on CMOS-compatible magnetoelectric transistors. These transistors could potentially offer improved performance and efficiency compared to current transistor technologies.
The Pennsylvania State University is working on heterogeneously integrated arrays for massively scalable sub-THz communications and sensing. This research could lead to the development of new technologies for high-speed communications and sensing.
Washington University is developing a one-shot petaops/w analog margin-propagation compute paradigm for RF-MIMO radar processing and classification. This research could potentially lead to more efficient and accurate radar systems.
The University of Texas at Austin is focusing on efficient edge inference and heterogeneous integration in systems for health and chemical sensing. This research could lead to the development of portable and efficient devices for health and chemical sensing.
The University of Texas at Dallas is working on co-designing Indium-based sol-gel precursors for extreme ultraviolet resist and back-end-of-the-line oxide nanoelectronics. This research could potentially lead to the development of new materials and processes for semiconductor manufacturing.
Stanford University is researching heterogeneous 3D integration of energy-efficient electronics with low-dimensional device layers. This research could potentially lead to the development of more efficient and powerful computing systems.
The Massachusetts Institute of Technology is co-designing a semiconductor-based quantum architecture platform for scalable quantum information processing. This research could potentially lead to the development of quantum computers, which could solve certain problems much faster than current computers.
The awards will support the broader goals of the "CHIPS and Science Act of 2022" to ensure long-term leadership in the microelectronics sector. The projects will also include comprehensive educational programs, emphasizing participation by all Americans, and fostering a diverse and skilled workforce.
The projects will focus on developing new materials and devices that overcome existing limitations in data storage, processing, and quantum information processing. They will also aim to accelerate the adoption of advanced electronic, photonic, and hybrid devices and components for sensing, memory, and energy.
FuSe2 includes nine first-time FuSe awardees, seven minority-serving institutions, and two NSF Established Program to Stimulate Competitive Research jurisdictions. The nine first-time FuSe prize winners supported by the latest NSF FuSe2 call are not publicly detailed in available sources as of now.
The projects will not only advance the state of computing technology but also contribute to the development of a skilled and diverse workforce, ensuring the continued leadership of the United States in the microelectronics sector.
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